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Please use this identifier to cite or link to this item: http://10.10.120.238:8080/xmlui/handle/123456789/558
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dc.contributor.authorKaith P.en_US
dc.contributor.authorGarg P.en_US
dc.contributor.authorBera A.en_US
dc.date.accessioned2023-11-30T08:41:37Z-
dc.date.available2023-11-30T08:41:37Z-
dc.date.issued2023-
dc.identifier.issn0003-6951-
dc.identifier.otherEID(2-s2.0-85151516478)-
dc.identifier.urihttps://dx.doi.org/10.1063/5.0146126-
dc.identifier.urihttp://localhost:8080/xmlui/handle/123456789/558-
dc.description.abstractLow-cost, stable, and easy-to-fabricate resistive switching memory (RSM) devices are highly desirable for next-generation nonvolatile memories. Spinel-structured CuFe2O4 (CFO), composed of earth-abundant, environmentally friendly elements, is a multifunctional material mainly featuring super-paramagnetism. This work explores the potential of spin-coated CFO thin films as an active material in RSM. A simple fluorine-doped tin oxide (FTO)/CFO/Ag device shows a bipolar resistive switching behavior with the problems like scattered SET and RESET voltages and endurance deterioration. Adding a TiO2 layer in the conventional device, we overcame the above limitations and achieved additional advantages of multilevel switching and improved temperature stability. The solution-processed FTO/TiO2/CFO/Ag bilayer device shows stable endurance with a maximum ON/OFF ratio of 100 with the ability to have multiple high resistance states and exhibits excellent temperature stability up to 250 °C. Our results further enhance the multifunctionality of CFO with the potential of being low-cost multilevel RSM. © 2023 Author(s).en_US
dc.language.isoenen_US
dc.publisherAmerican Institute of Physics Inc.en_US
dc.sourceApplied Physics Lettersen_US
dc.titleMultilevel resistive switching in solution-processed CuFe2O4/TiO2heterostructureen_US
dc.typeJournal Articleen_US
Appears in Collections:Journal Article

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