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Please use this identifier to cite or link to this item: http://10.10.120.238:8080/xmlui/handle/123456789/445
Title: Bubble growth and departure behavior in subcooled flow boiling regime
Authors: Chitnavis N.
Pothukuchi H.
Patnaik B.S.V.
Issue Date: 2023
Publisher: American Institute of Physics Inc.
Abstract: Understanding the detailed dynamics of bubble ebullition cycle is central to effectively exploit coolant phase change in subcooled flow boiling. In the present study, the bubble growth rate and the bubble departure mechanism in subcooled flow boiling conditions are investigated. The bubble growth rate is estimated by employing an energy balance model, which ensures that the applied wall heat flux contribution to components, such as (i) microlayer evaporation, (ii) conduction through superheated layer region, and (iii) condensation heat transfer, are accounted. The bubble departure diameter and the type of departure (i.e., sliding or lift-off) are predicted using a simple force balance model on the vapor bubble. The implemented models are thoroughly validated against the benchmark experimental data. Furthermore, the influence of operating conditions, viz., pressure ( 1 - 3 bar ), mass flux ( 200 - 1000 kgm − 2 s − 1 ), heat flux ( 200 - 500 kWm − 2 ), and the degree of subcooling (20-30 K) on the bubble dynamics, is investigated for subcooled flow boiling conditions. Based on the parameters considered, a flow regime map is developed to identify the bubble departure type and diameter for a given set of operating conditions. It was noticed that the bubble departure diameter was maximum at low pressure (1 bar), low mass flux ( 200 kgm − 2 s − 1 ) , high heat flux ( 500 kWm − 2 ) , and low degree of subcooling (20 °C). For all the values of pressure and degree of subcooling, the sliding mode of departure was noticed at low and high mass flux values, whereas bubble departs by lift-off for moderate values of mass flux. © 2023 Author(s).
URI: https://dx.doi.org/10.1063/5.0145889
http://localhost:8080/xmlui/handle/123456789/445
ISSN: 1070-6631
Appears in Collections:Journal Article

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